GRGTEST FIB Teknoloji pèmèt kontwòl kalite egzat
In fields such as material science, electronic manufacturing, and surface engineering, film thickness measurement is a critical step in ensuring product quality and performance. The accuracy of the film layer's thickness directly impacts the product's reliability, functionality, and lifespan. However, traditional film thickness testing methods often face numerous limitations when dealing with complex and diverse samples and high-precision testing Kondisyon .
Dilèm nan metòd tès tradisyonèl epesè fim
1. Echantiyon Preparasyon Miwa Deteksyon Epesè: Preparasyon echantiyon an konplike epi presizyon an limite
To measure the thickness of a sample, it must first be sealed with epoxy resin, then ground and polished with sandpaper, and finally measured using a microscope. This process demands a high level of sample preparation, ensuring that there is no delamination between the film surface and the sealing material. The epoxy resin sealing process releases a significant amount of heat, which can adversely affect the Tèmik-sansib kouch fim .
2. XRF Fluoresans Epesè Mezi: Range aplikasyon etwat, ensifizan presizyon
XRF Fluoresans Epesè Mezi dwe gen moso estanda ki koresponn a metal la ak ranje epesè, epi yo pa ka mezire epesè a nan ki pa metalik fim . An menm tan an, kòm yon metòd tès ki pa destriktif, erè a presizyon se gwo nan nivo ki anba a 100 nanomètr, ki se difisil a satisfè kondisyon ki gen gwo precision nan {ou.
Teknoloji FIB: kraze nan limit yo nan tradisyonèl yo, louvri yon nouvo chapit nan deteksyon presizyon
GRGTEST employs FIB (focused ion beam) technology, which, with its unique working principle and significant advantages, offers a revolutionary solution for film thickness testing. This technology uses electromagnetic lenses to focus the ion beam into an extremely small size, resulting in a highly precise and energetic beam. By bombarding the sample surface with a high-energy ion beam, the Se efè sputtering pwodwi, efektivman retire materyèl nan grave .
- Pou fim sansib òganik ak lòt echantiyon, teknoloji FIB ka depoze yon kouch pwoteksyon, anpil diminye enpak la nan pwosesis grave sou echantiyon an, konplètman evite pwoblèm nan estrès tèmik ki te pwodwi pandan solidifikasyon epoksidik, epi asire ke pèfòmans nan kouch nan fim tèmik se pa domaje .}}
- Pwoblèm lan nan ekstansyon fim fondamantalman evite lè l sèvi avèk ion gwo bout bwa grave .
- Anplis de eleman yo li te ye kouch pwoteksyon, teknoloji FIB pa prezante lòt eleman pandan pwosesis tès la, epi yo ka konplètman evite entèferans nan eleman polisyon ekstèn nan pwosesis la preparasyon echantiyon nan analiz la nan sifas la oswa eleman entèn nan kouch nan fim .
